31 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP1003 series SP1003 general purpose esd protection - SP1003 series description applications zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at 30kv (contact discharge, iec 61000-4-2) without performance degradation. additionally, each diode can safely dissipate 7a of 8/20s surge current (iec61000-4-5) with very low clamping voltages. features t & 4 %
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30kv contact, 30kv air t & ' 5
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" (5/50ns) t - j h i u o j o h
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7a (8/20s) t - p x m f b l b h f d v s s f o u p g 100na (max) at 5v t 5 j o z 4 0 % q b d l b h f saves board space t ' j u t t p m e f s g p p u q s j o u p g industry standard 0402 (1005) devices t . p c j m f q i p o f t t 4 n b s u q i p o f t t 1 % " t t 1 p s u b c m f o b w j h b u j p o devices t % j h j u b m d b n f s b t t 1 p s u b c m f n f e j d b m e f w j d f t pinout 1 2 functional block diagram 1 2 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example shield ground signal ground i/o port controller low - speed port outside world (4) SP1003-01d t g b1 b2 b3 b4 shield ground signal ground i/o port controller low - speed port b1 b2 b3 b4 SP1003 series - 30pf 30kv unidirectional discrete tvs
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 32 tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP1003 series general purpose esd protection - SP1003 series 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 1 2 3 4 5 6 7 peak pulse current-i pp (a) clamp voltage (v c ) 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 3 5 .0 0 10 20 30 40 5 0 temperature (oc) leakage current (na) caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. absolute maximum ratings symbol parameter value units i pp peak pulse current (t p =8/20s) 7.0 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units forward voltage drop v f i f = 10ma 0.8 1.2 v reverse voltage drop v r i r =1ma 7.0 7.8 8.5 v reverse standoff voltage v rwm i r 1a 5.0 v reverse leakage current i leak v r =5v 100 na clamp voltage 1 v c i pp =6a t p =8/20s 11.4 v i pp =7a t p =8/20s 12.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 0.6 esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c d reverse bias=0v 30 pf note: 1 parameter is guaranteed by design and/or device characterization. pulse waveform capacitance vs. reverse bias clamping voltage vs. i pp 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 3 5 .0 40.0 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 5 5 .0 dc bias (v) capacitance (pf) 0% 10% 20% 30% 40% 5 0% 60% 70% 80% 90% 100% 110% 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 time (s) percent of i pp leakage vs. temperature
33 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP1003 series SP1003 general purpose esd protection - SP1003 series time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p reheat ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zone t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters package dimensions sod723 symbol sod723 millimeters inches min max min max a 0.46 0.51 0.018 0.020 b 0.23 0.28 0.009 0.011 c 0.08 0.13 0.003 0.005 d 0.99 1.04 0.039 0.041 e 0.58 0.64 0.023 0.025 he 1.37 1.47 0.054 0.058 l 0.15 0.25 0.006 0.010 l h e b c a e d recommended solder pad layout 1. 10 [0.043] 0. 5 0 [0.020] 0.4 5 [0.018] millimeters (inches)
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 34 tvs diode arrays (spa ? family of products) revision: april 14, 2011 SP1003 series general purpose esd protection - SP1003 series embossed carrier tape & reel speci?cation sod723 symbol millimetres inches min max min max e 1.65 1.85 0.064 0.072 f 3.45 3.55 0.135 0.139 d1 0.45 0.55 0.017 0.021 d 150 - - 0.06 - - po 3.90 4.10 0.153 0.161 10po 40.0+/- 0.20 1.57+/-0.01 w 7.90 8.20 0.311 0.322 po 1.90 2.10 0.074 0.082 ao 0.63 0.73 0.024 0.028 a1 0.33 ref 0.01 ref bo 1.66 1.76 0.07 0.07 b1 1.10 ref 0.04 ref ko 0.54 0.64 0.021 0.025 t - - 0.21 - - 0.008 ko ao a1 ?d1 p ?d w e f bo b1 t po p2 ordering information part number package marking min. order qty. SP1003-01dtg sod723 c 8000 product characteristics lead plating pre-plated frame or matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. part numbering system part marking system sp 1003 01 d t g series number of channels package d: sod723 t= tape & reel g= green C silicon protection array (spa tm ) family of tvs diode arrays c product series pin 1 indicator
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